Senior Project Manager Molded Modules (w/m/div)*

☞ Infineon Technologies

Ver: 235

Dia de atualização: 24-10-2024

Localização: Regensburg Bavaria

Categoria: Design - Web Alta tecnologia Mecânico / Técnico Elétrica / Eletrônica Planejamento / Projetos

Indústria: Electrical Electronic Manufacturing

Posição: Mid-Senior level

Tipo de empregos: Full-time

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Conteúdo do emprego

The backend (BE) segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.

The term gender in the sense of the General Equal Treatment Act (GETA) or other national legislation refers to the biological assignment to a gender group. At Infineon we are proud to embrace (gender) diversity, including female, male and diverse.

This position is part of the Project Management Career Path which provides an attractive career opportunity for employees who focus on managing projects and functional leadership of project team members.

In your new role you will:

  • Management of complex package development projects
  • Planning and controlling of project resources, reporting internally and, if necessary, externally as well as controlling and documentation of the Project progress
  • Lead package development teamontranslation of customer requirements into appropriate package requirements
  • Conduct feasibility studies, evaluate risks, identify deviationsand counter control toachieve the targets
  • Assess package costs andrefine production concept
  • Handover to the Ramp Up Team or the participating production units
  • Close collaboration with the BUs, InfineonFrontend andBackend segmentas well as the responsible development departments
  • Support for customer enquiries, FAR’s as well as auditsand evaluation of the patent situation

You demonstrate funded process, materials, methods and equipment concept knowhow as well as strong communication capabilities to establish lasting relationships and networks. Furthermore, you have strong analytical skills, are a cohesive and collaborative team player and have a level headed, open minded personality.

You are best equipped for this task if you:

  • Possesses at least a Bachelor Degree in Electrical Engineering or similar. An advanced degree withMaster/PhD would be an addedadvantage.
  • 5+ years of project management experience in the power semiconductor package development or semiconductor industrywith focus in package assembly development.
  • Good project leadership skills, interpersonal skills and communication skills at all levels.
  • A self starter, self-motivated and a goal getter.
  • Fluency in English is required in leading a multi-cultural teams internally and externally.

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Data limite: 08-12-2024

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