Package Development Engineer

☞ Microchip Technology Inc.

Ver: 236

Día de actualización: 24-10-2024

Ubicación: Heilbronn Baden-Württemberg

Categoría: Alta tecnología Mecánica / Técnica Eléctrica / Electrónica

Industria: Electrical Electronic Manufacturing Semiconductors

Posición: Entry level

Tipo de empleo: Full-time

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Contenido de trabajo

Company Description

Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM). We also license Flash-IP solutions that are incorporated in a broad range of products.

Job Description

Reporting to the Package Development Manager you will be part of Heilbronn Corporate Package Technology Development Team. As a Package Development Engineer, you will be in charge of Packaging solutions for electronic components of APID (Analog Power and Interface Division) and WSG (Wireless Solution Group) Business Units, mainly for Automotive applications. The main package families handled in Heilbronn are leaded packages, such as QFN or SOIC, as well as laminate packages like BGA. A smaller part of the package portfolio are SiP Modules, such as Transponders or Micromodules.

You will be in close collaboration with Design and Product Engineering teams of the respective Business units, as well as with the worldwide manufacturing facilities

What’s attractive about this opportunity?

This position will expose you to a large autonomy of work to identify the most optimized package solutions and will allow you to develop your knowledges within a global acting company and a large variety of subcontractors.

More details on the expectations and responsibilities in this position:
  • Handle Package development, including all technical aspects like design and material selection to fulfill the requirements defined by BU and Quality.
  • Perform feasibility studies, evaluation, qualification and industrialization of package solutions
  • Support the BU during the development of new devices, create documentation and specification related to the new package/device.
  • Evaluate new assembly processes and materials with the goal improving reliability and cost structure of the devices
  • Collaborate with Marketing, Silicon designers, Product Engineers, Production Subcontractors, Assy Eng’g,
  • Support Failure Analysis related to package issues, for external customers or during Qualifications.
Job Requirements

Mandatory Skills
  • Master’s Degree of science in Mechanical Engineering, Physics or Material science
  • 5 - 10 years professional experience in Semiconductor or Automotive Industries
  • Skills:
    • Knowledge of Packaging Technologies and Assembly Process,
    • Understands Metallurgy of electronic components,
    • Analytical and problem-solving skills
    • Work with technical databases
    • Curious and interested in new technologies
    • English (high level)
    • Teamwork in global multicultural teams; worldwide travel
Preferred Skills
  • Setup thermal-mechanical models and Finite Elements Analysis
  • Familiar with Package Reliability Tests and AECQ100 / AECQ006 rules
  • Familiar with SPC
  • Basic knowledge of Linux
  • Basic knowledge of ACAD software
  • Setup and interpretation of DOE studies
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Plazo: 08-12-2024

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